发明名称 |
SEMICONDUCTOR PACKAGE AND ITS MANUFACTURE |
摘要 |
A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures. |
申请公布号 |
EP2243161(A2) |
申请公布日期 |
2010.10.27 |
申请号 |
EP20090706541 |
申请日期 |
2009.01.30 |
申请人 |
IMEC;KATHOLIEKE UNIVERSITEIT LEUVEN;UNIVERSITEIT GENT |
发明人 |
LIMAYE, PARESH;VANFLETEREN, JAN;BEYNE, ERIC |
分类号 |
H01L23/498;H01L23/13 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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