发明名称 ELECTRONIC COMPONENT PACKING BODY
摘要 <p>The present disclosure provides a packaged article containing an electronic device being capable of preventing the adhesion of the electronic devices to the cover tape (pickup failure) resulting from the static and the part breakage caused by ESD, by inhibiting the static caused by the friction between the contained electronic devices (especially small/light weight electronic devices) and the cover tape. A packaged article containing an electronic device which comprises an electronic device-packaging carrier tape and an electronic device-packaging cover tape, wherein a layer in said cover tape contacting with said carrier tape contains an adhesive resin (A) and an electrically-charged resin (B) charging opposite to the charging polarity of said adhesive resin (A) generating at the time of friction between said adhesive resin (A) and said electronic device.</p>
申请公布号 EP2145838(A4) 申请公布日期 2010.10.27
申请号 EP20080740470 申请日期 2008.04.09
申请人 SUMITOMO BAKELITE CO., LTD. 发明人 HIRAMATSU, MASAYUKI
分类号 B65D85/38;B32B27/08;B65D65/40;B65D73/02;B65D85/86;H05K9/00 主分类号 B65D85/38
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