| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure device which can be exposed, without manufacturing a mask member at each time to wafers at different spacings of partitioning schedule line each time. <P>SOLUTION: The exposure device exposes along a partitioning schedule line a resist film, covered by the rear surface or the front surface of the wafer on which the partitioning schedule line of a lattice state is formed in the front surface. The exposure device includes a chuck table for holding the wafer, an alignment means, a line exposure means for exposing a line light, and an index means for relatively moving the chuck table and the line exposure means. The line exposure means has a mask means having a reticle mask, in which a light-shielding layer and a reticle mask in which the line shape light transmission part is formed, and a light-emitting means which exposes the line light through the light transmission part of the line shape of the reticle mask. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
