发明名称 FLEXIBLE CIRCUIT BOARD ASSEMBLY
摘要 <p>A flexible circuit board assembly and method includes a rigid circuit board having a first portion and a second portion separated by a bending region. A plurality of grooves are cut into the bending region. The grooves are cut substantially parallel to an axis about which the bending region is bent. Preferably, the grooves are located on an inside bending radius of the circuit board, but can be located on the outside radius or both.</p>
申请公布号 EP1726191(B1) 申请公布日期 2010.10.27
申请号 EP20050705493 申请日期 2005.01.11
申请人 MOTOROLA, INC. 发明人 GALL, THOMAS, P.;HAWKINS, RICHARD, A.;MOORE, KEVIN, D.
分类号 H05K1/00;B32B3/28;H05K1/03;H05K3/00 主分类号 H05K1/00
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