发明名称 Light emitting diode, backlight assembly having the same and method thereof
摘要 A light emitting diode (LED). In one embodiment, the LED comprises a base including a cavity, an LED chip disposed on a bottom of the cavity and configured to generate a first light, and a light conversion layer. The light conversion layer includes an upper substrate, a lower substrate and a wavelength conversion particle. The light conversion layer is configured to convert a portion of the first light into a second light according to light emitted by the wavelength conversion particle. Furthermore, the light conversion layer is disposed on an upper surface of the base.
申请公布号 US7819539(B2) 申请公布日期 2010.10.26
申请号 US20090423660 申请日期 2009.04.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM GUN-WOO;PARK JAE-BYUNG;CHO DON-CHAN;PARK HAE-IL;BYUN JIN-SEOB;SHIN JUNG-HAN;YOON SEON-TAE;HONG SUNG-JIN
分类号 F21V33/00 主分类号 F21V33/00
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