发明名称 |
Light emitting diode, backlight assembly having the same and method thereof |
摘要 |
A light emitting diode (LED). In one embodiment, the LED comprises a base including a cavity, an LED chip disposed on a bottom of the cavity and configured to generate a first light, and a light conversion layer. The light conversion layer includes an upper substrate, a lower substrate and a wavelength conversion particle. The light conversion layer is configured to convert a portion of the first light into a second light according to light emitted by the wavelength conversion particle. Furthermore, the light conversion layer is disposed on an upper surface of the base.
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申请公布号 |
US7819539(B2) |
申请公布日期 |
2010.10.26 |
申请号 |
US20090423660 |
申请日期 |
2009.04.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM GUN-WOO;PARK JAE-BYUNG;CHO DON-CHAN;PARK HAE-IL;BYUN JIN-SEOB;SHIN JUNG-HAN;YOON SEON-TAE;HONG SUNG-JIN |
分类号 |
F21V33/00 |
主分类号 |
F21V33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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