| 发明名称 |
System and method for removing particles in semiconductor manufacturing |
| 摘要 |
A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
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| 申请公布号 |
US7819980(B2) |
申请公布日期 |
2010.10.26 |
| 申请号 |
US20050204691 |
申请日期 |
2005.08.16 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HSIA CHEN-YUAN;HUNG CHANG-CHENG;LU CHI-LUN;CHANG SHIH-MING;WANG WEN-CHUAN;HUANG YEN-BIN;CHANG CHING-YU;LIN CHIN-HSIANG |
| 分类号 |
C25F1/00;C25F3/30;C25F5/00 |
主分类号 |
C25F1/00 |
| 代理机构 |
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