发明名称 |
Power and ground routing of integrated circuit devices with improved IR drop and chip performance |
摘要 |
An integrated circuit chip with reduced IR drop and improved chip performance is disclosed. The integrated circuit chip includes a semiconductor substrate having thereon a plurality of inter-metal dielectric (IMD) layers and a plurality of copper metal layers embedded in respective the plurality of IMD layers; a first passivation layer overlying the plurality of IMD layers and the plurality of copper metal layers; a first power/ground ring of a circuit block of the integrated circuit chip formed in a topmost layer of the plurality of copper metal layers; a second power/ground ring of the circuit block of the integrated circuit chip formed in an aluminum layer over the first passivation layer; and a second passivation layer covering the second power/ground ring and the first passivation layer. |
申请公布号 |
US7821038(B2) |
申请公布日期 |
2010.10.26 |
申请号 |
US20080052735 |
申请日期 |
2008.03.21 |
申请人 |
MEDIATEK INC. |
发明人 |
KO CHING-CHUNG;CHENG TAO;LIU TIEN-YUEH;CHOU DAR-SHII;KAO PENG-CHENG |
分类号 |
H01L27/10 |
主分类号 |
H01L27/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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