发明名称 |
Encapsulated optical package |
摘要 |
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.
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申请公布号 |
US7820462(B2) |
申请公布日期 |
2010.10.26 |
申请号 |
US20060569751 |
申请日期 |
2006.11.29 |
申请人 |
REFLEX PHOTONICS INC. |
发明人 |
ROLSTON DAVID ROBERT CAMERON;MAJ TOMASZ;FU SHAO-WEI |
分类号 |
H01L21/66;G01R31/26;G02B6/36;G02B6/42 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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