发明名称 |
FLAME RETARDANT RESIN COMPOSITION FOR HIGHLY PEEL-STRENGHTHENED PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE SAME AND MANUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: A flame-retardant resin composition, a printed circuit board using thereof, and a manufacturing method of the printed circuit board are provided to secure the excellent adhesive force of the printed circuit board with a plating layer. CONSTITUTION: A flame-retardant resin composition for a printed circuit board contains the following: a complex resin including a bisphenol-A type epoxy resin, a cresol novolak epoxy resin, a rubber transformed epoxy resin, and a phosphor based epoxy resin; a hardener; a curing accelerator; and a calcium carbonate based inorganic filler.
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申请公布号 |
KR20100114655(A) |
申请公布日期 |
2010.10.26 |
申请号 |
KR20090033138 |
申请日期 |
2009.04.16 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, HWA YOUNG;OH, JUN ROK;LIM, SUNG TAEK;PARK, MOON SOO;CHO, JAE CHOON |
分类号 |
C08L63/00;C08K3/26;C08K5/00;H05K1/03 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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