发明名称 FLAME RETARDANT RESIN COMPOSITION FOR HIGHLY PEEL-STRENGHTHENED PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE SAME AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A flame-retardant resin composition, a printed circuit board using thereof, and a manufacturing method of the printed circuit board are provided to secure the excellent adhesive force of the printed circuit board with a plating layer. CONSTITUTION: A flame-retardant resin composition for a printed circuit board contains the following: a complex resin including a bisphenol-A type epoxy resin, a cresol novolak epoxy resin, a rubber transformed epoxy resin, and a phosphor based epoxy resin; a hardener; a curing accelerator; and a calcium carbonate based inorganic filler.
申请公布号 KR20100114655(A) 申请公布日期 2010.10.26
申请号 KR20090033138 申请日期 2009.04.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, HWA YOUNG;OH, JUN ROK;LIM, SUNG TAEK;PARK, MOON SOO;CHO, JAE CHOON
分类号 C08L63/00;C08K3/26;C08K5/00;H05K1/03 主分类号 C08L63/00
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