| 摘要 |
PURPOSE: A device for removing gas remaining on a wafer by spraying heated nitrogen gas is provided to prevent remaining gas on a movable module by discharging the gas remaining on a wafer through an exhaust pipe. CONSTITUTION: A plurality of wafers(10) are loaded on a stacker(420). A case(412) is opened to receive the part of descending air current. A plurality of exhaust slots are formed on the rear side of the stacker to move the descending air current in parallel to one side of the wafer. The exhaust pipe is formed on the lower side of the case to exhaust the descending air current inputted through an exhaust slot. A spraying pipe(440) to spray the heated gas is combined with the front of the case.
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