发明名称 |
Conductive layers and fabrication methods thereof |
摘要 |
Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.).
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申请公布号 |
US7821136(B2) |
申请公布日期 |
2010.10.26 |
申请号 |
US20060552534 |
申请日期 |
2006.10.25 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HOUNG YING-CHANG;LIN HONG-CHING;SHIH CHI-JEN;SHIH SHAO-JU |
分类号 |
H01L23/48;C23C18/06;C23C18/08;H01B1/22;H01L21/4763;H01L23/52;H01L29/40;H05K1/09;H05K3/10 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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