发明名称 Conductive layers and fabrication methods thereof
摘要 Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.).
申请公布号 US7821136(B2) 申请公布日期 2010.10.26
申请号 US20060552534 申请日期 2006.10.25
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 HOUNG YING-CHANG;LIN HONG-CHING;SHIH CHI-JEN;SHIH SHAO-JU
分类号 H01L23/48;C23C18/06;C23C18/08;H01B1/22;H01L21/4763;H01L23/52;H01L29/40;H05K1/09;H05K3/10 主分类号 H01L23/48
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