发明名称 |
WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART |
摘要 |
PURPOSE: A wiring board including a pillar shape protrusion is provided to improve the connection reliability by including the protrusion functions as at least part of the connection terminal of the wiring board. CONSTITUTION: A first metal layer including a pillar shape through hole is formed on one side of a supporting unit. The surface of the supporting unit is exposed by the through hole. The through hole is filled by a pillar shape metal layer. An insulting layer(12a) is formed on the pillar shape metal layer and the first metal layer. A wiring layer is formed on one side of the insulating layer. The supporting unit and the first metal layer are eliminated a protrusion is protruded from one side of the insulating layer. |
申请公布号 |
KR20100114845(A) |
申请公布日期 |
2010.10.26 |
申请号 |
KR20100034673 |
申请日期 |
2010.04.15 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KODANI KOTARO;NAKAMURA JUNICHI |
分类号 |
H05K3/40;H05K1/11;H05K3/46 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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