发明名称 WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART
摘要 PURPOSE: A wiring board including a pillar shape protrusion is provided to improve the connection reliability by including the protrusion functions as at least part of the connection terminal of the wiring board. CONSTITUTION: A first metal layer including a pillar shape through hole is formed on one side of a supporting unit. The surface of the supporting unit is exposed by the through hole. The through hole is filled by a pillar shape metal layer. An insulting layer(12a) is formed on the pillar shape metal layer and the first metal layer. A wiring layer is formed on one side of the insulating layer. The supporting unit and the first metal layer are eliminated a protrusion is protruded from one side of the insulating layer.
申请公布号 KR20100114845(A) 申请公布日期 2010.10.26
申请号 KR20100034673 申请日期 2010.04.15
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 KODANI KOTARO;NAKAMURA JUNICHI
分类号 H05K3/40;H05K1/11;H05K3/46 主分类号 H05K3/40
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