发明名称 Stressed dielectric devices and methods of fabricating same
摘要 A structure and a method of making the structure. The structure includes a field effect transistor including: a first and a second source/drain formed in a silicon substrate, the first and second source/drains spaced apart and separated by a channel region in the substrate; a gate dielectric on a top surface of the substrate over the channel region; and an electrically conductive gate on a top surface of the gate dielectric; and a dielectric pillar of a first dielectric material over the gate; and a dielectric layer of a second dielectric material over the first and second source/drains, sidewalls of the dielectric pillar in direct physical contact with the dielectric layer, the dielectric pillar having no internal stress or an internal stress different from an internal stress of the dielectric layer.
申请公布号 US7821109(B2) 申请公布日期 2010.10.26
申请号 US20090570045 申请日期 2009.09.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ANDERSON BRENT ALAN;NOWAK EDWARD JOSEPH
分类号 H01L23/58 主分类号 H01L23/58
代理机构 代理人
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