发明名称 |
Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments |
摘要 |
A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.
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申请公布号 |
US7818879(B2) |
申请公布日期 |
2010.10.26 |
申请号 |
US20090382349 |
申请日期 |
2009.03.13 |
申请人 |
GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS, INC. |
发明人 |
PAI DEEPAK K. |
分类号 |
H01R43/20 |
主分类号 |
H01R43/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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