发明名称 MANUFACTURING DEVICE AND METHOD OF FLAT TYPE HEAT SPREADER AND A HEAT SPREADER OBTAINED BY THE SAME
摘要 PURPOSE: A heat spreader, a manufacturing device thereof, and a manufacturing method thereof are provided to cool a semiconductor device or electronic device by using latent heat according to phase change of heating mediums injected into a channel. CONSTITUTION: A pump unit(110) includes a hydraulic pump(111), a vacuum pump(112), and a booster pump(113). The pump unit is prepared inside a casing(210). A controller(211) and a heating medium storage tank(120) are prepared on the upper side of the casing. A finger unit(150) is comprised of a finger base, a finger block, and a fingering first cylinder. A finger lifting unit is comprised of a lifting cylinder to vertically lift the finger unit.
申请公布号 KR100989518(B1) 申请公布日期 2010.10.25
申请号 KR20090133827 申请日期 2009.12.30
申请人 SEKI HI-TECK CO., LTD. 发明人 BAE, YOUNG KI;JUNG, BONG KI;SEO, JIN KOOK;LIM, JAE HWAN;KIM, YOUNG JU;LEE, SANG ICK
分类号 H01L23/34 主分类号 H01L23/34
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