发明名称 |
MANUFACTURING DEVICE AND METHOD OF FLAT TYPE HEAT SPREADER AND A HEAT SPREADER OBTAINED BY THE SAME |
摘要 |
PURPOSE: A heat spreader, a manufacturing device thereof, and a manufacturing method thereof are provided to cool a semiconductor device or electronic device by using latent heat according to phase change of heating mediums injected into a channel. CONSTITUTION: A pump unit(110) includes a hydraulic pump(111), a vacuum pump(112), and a booster pump(113). The pump unit is prepared inside a casing(210). A controller(211) and a heating medium storage tank(120) are prepared on the upper side of the casing. A finger unit(150) is comprised of a finger base, a finger block, and a fingering first cylinder. A finger lifting unit is comprised of a lifting cylinder to vertically lift the finger unit.
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申请公布号 |
KR100989518(B1) |
申请公布日期 |
2010.10.25 |
申请号 |
KR20090133827 |
申请日期 |
2009.12.30 |
申请人 |
SEKI HI-TECK CO., LTD. |
发明人 |
BAE, YOUNG KI;JUNG, BONG KI;SEO, JIN KOOK;LIM, JAE HWAN;KIM, YOUNG JU;LEE, SANG ICK |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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