| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce material cost, by overcoming the problem that a gold wire is used as a metal thin wire in a conventional semiconductor device, which makes it difficult to reduce the material cost. <P>SOLUTION: In the semiconductor device, a semiconductor element 9 is secured onto an island 7, and a plurality of through-holes 11 are formed on the island 7 around the area to which the semiconductor element 9 is secured. Then, the electrode pads of the semiconductor element 9 and leads 4 are electrically connected by copper wires 10. In this structure, the material cost is reduced by using the copper wires 10 in comparison with gold wires. Also, by embedding part of a resin package 2 in the through-holes 11, the island 7 is easily supported within the resin package 2. <P>COPYRIGHT: (C)2011,JPO&INPIT |
