| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive ink that improves the bondability between an electrode and a bump, and to provide a method of forming a bump and an electronic component. <P>SOLUTION: The inductive ink 16 is provided for forming the bump 18 on the electrode 12 made of a base metal element that is formed on an IC chip or a substrate 10 by a droplet ejection method using a droplet ejection head 14. The inductive ink 16 uses a solvent containing an organic compound that contains metal such as Ag nano-particles and an alcoholic hydroxy group. <P>COPYRIGHT: (C)2011,JPO&INPIT |
