| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate sheet with a conductive bump that can decrease the number of steps for applying conductive paste to a substrate sheet surface, thus shortening a manufacturing time of the substrate with a conductive bump and a manufacturing method of a multilayered printed wiring board that can shorten the manufacturing time for the multilayered printed wiring board. <P>SOLUTION: A mold material 16 with through-holes 16a is placed on a substrate sheet 10. Then, when screen printing is performed, the screen plate 32 and the mold material 16 are brought into contact with each other, and using each through-hole 32a of the screen plate 32 and each through-hole 16a of the mold material 16, the conductive paste 38 is made to adhere to the substrate sheet 10. Then, each conductive paste 38 on the substrate sheet 10 is cured to make a conductive bump 14, and the form 16 is taken out of the substrate sheet 10 to obtain the substrate sheet 10 with a conductive bump 14. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
