Substrat zur Aufnahme mindestens eines Bauelements und Verfahren zur Herstellung eines Substrats

摘要

The substrate has a substrate body (1) provided at the front and rear sides with an electrically conductive layer (3). An electrically insulated connection layer (2) is provided between the substrate body and the electrically conductive layer, which has a duroplastic matrix formed from the pre-ceramic polymer. The ceramic material is selected from the group consisting of boron nitride, silicon carbide, silicon nitride powder, aluminum nitride, steatite and cordierite. The substrate body is made of a ceramic of a plastic or plastic composite material. An independent claim is also included for a method for supporting a component, particularly a power semiconductor.