| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate holding member for restraining a deterioration in a substrate placement section by sliding with a substrate when placing the substrate on the substrate holding member including the substrate placement section for sucking and holding, and to provide a vacuum chuck and a liquid treatment apparatus for restraining a deterioration in the substrate placement section by a treatment liquid when performing liquid treatment by supplying a treatment liquid from an upper side to the surface of the substrate on the substrate placement section. SOLUTION: A diamond-like carbon film 25 is film-formed to cover a holding surface for sucking and holding at least a wafer W such that a carbon fiber 24 formed so that an edge projects outside from the surface of a table 11 is buried in a resin for composing the table 11. Also, when supplying a treatment liquid to the surface of the wafer W sucked and held on the table 11 for liquid treatment, a diamond-like carbon film including fluorine is formed on the side circumferential face and rear of the table 11 communicating with the surface of the wafer W. COPYRIGHT: (C)2011,JPO&INPIT |
