发明名称 ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To improve efficiency of the detaching operation of a heat pipe. <P>SOLUTION: An electronic apparatus includes: a body 4; a circuit board 14 housed in the body 4; a heating body 22 mounted on the circuit board 14; a heat pipe 32 having an end portion 32c, a heat emitting portion 32b located on an opposite side to the end portion 32c, and a heat receiving portion 32a located between the end portion 32c and the heat emitting portion 32b and thermally connected to the heating body; a bonding member 39 which has thermal conductivity and is disposed between the heating body 22 and the heat receiving portion 32a and which bonds the heating body 22 to the heat receiving portion 32a; and an extension 32c1 that extends from the end portion 32c toward the circuit board 14 side. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010237767(A) 申请公布日期 2010.10.21
申请号 JP20090082340 申请日期 2009.03.30
申请人 TOSHIBA CORP 发明人 HONGO TAKESHI
分类号 G06F1/20;F28D15/02;H01L23/40;H01L23/427;H05K7/20 主分类号 G06F1/20
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