| 摘要 |
PROBLEM TO BE SOLVED: To provide a process of processing a semiconductor wafer, by which back surface grinding of the semiconductor wafer having large unevenness is facilitated, the wafer is easily divided into individual chips and a sheet can be peeled without incurring any problem of remaining paste. SOLUTION: A sheet 20 for surface protection is stuck on a circuit surface 10S, and a half-cut groove 10K is formed by carrying out half-cut dicing on the wafer 10 from the side of the sheet 20 for surface protection. A sheet 30 for grinding is put over and stuck on the sheet 20 for surface protection, and the back surface of the wafer 10 is ground. After the wafer 10 is divided into individual chips 18 through the grinding, the sheet side is irradiated with ultraviolet light to cure the sheet 20 for surface protection. Further, the sheet 20 for surface protection 20 is heated to shrink and then peeled after decreasing an area of contact with the individual chip 18. COPYRIGHT: (C)2011,JPO&INPIT |
