| 发明名称 |
SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES |
| 摘要 |
A semiconductor package is described. The semiconductor package includes an internal housing and a semiconductor die coupled with the internal housing by a layer of self-healing thermal interface material.
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| 申请公布号 |
US2010264536(A1) |
申请公布日期 |
2010.10.21 |
| 申请号 |
US20100826398 |
申请日期 |
2010.06.29 |
| 申请人 |
SHANKAR RAVI;RARAVIKAR NACHIKET R;XU DINGYING |
发明人 |
SHANKAR RAVI;RARAVIKAR NACHIKET R.;XU DINGYING |
| 分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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