IMPROVED APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING
摘要
An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.
申请公布号
WO2010121068(A2)
申请公布日期
2010.10.21
申请号
WO2010US31302
申请日期
2010.04.15
申请人
SUSS MICROTEC, INC.
发明人
GEORGE, GREGORY;JOHNSON, HALE;GORUN, PATRICK;HUGHLETT, EMMETT;HERMANOWSKI, JAMES;STILES, MATTHEW;KUHNLE, MICHAEL;PATRICIO, DENNIS