发明名称 PATTERN FORMING METHOD, POSITIVE RESIST COMPOSITION FOR MULTIPLE DEVELOPMENT USED IN THE PATTERN FORMING METHOD, DEVELOPER FOR NEGATIVE DEVELOPMENT USED IN THE PATTERN FORMING METHOD, AND RINSING SOLUTION FOR NEGATIVE DEVELOPMENT USED IN THE PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of stably forming a high precision fine pattern for use in manufacturing processes of semiconductor devices like ICs, manufacturing of circuit boards of liquid crystal, thermal heads, etc., and the other photofabrication processes, a resin composition for use in this method, a developer for use in this method, and a rinsing solution for negative development for use in this method. <P>SOLUTION: A pattern forming method includes: (&alpha;) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation; (&beta;) exposing the resist film; and (&delta;) developing the resist film with a negative developer. A positive resist composition for multiple development for use in the method, a developer for use in the method, and a rinsing solution for negative development for use in the method are provided. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010237695(A) 申请公布日期 2010.10.21
申请号 JP20100123584 申请日期 2010.05.28
申请人 FUJIFILM CORP 发明人 TSUBAKI HIDEAKI;KANNA SHINICHI
分类号 G03F7/40;G03F7/039;G03F7/32;G03F7/38;H01L21/027 主分类号 G03F7/40
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