发明名称 |
SOLDER LAYER, HEAT SINK USING SUCH A SOLDER LAYER AND METHOD FOR MANUFACTURING SUCH A HEAT SINK |
摘要 |
A heat sink (10) is disclosed which comprises a substrate (1), an electrode layer (2) formed on the substrate (1) and a solder layer (3) formed on the substrate (1) wherein the solder layer (3) provides a bonding strength of not less than 30 MPa and a shear strain of not less than 0.07. The heat sink may be a sub-mount which comprises a sub-mount substrate (1), an electrode layer (2) formed on the substrate (1) and a solder layer (3) formed on the substrate (1) wherein the electrode layer (2) is formed with a window portion (2A) having the solder layer (3) embedded therein and is connected to an outer peripheral area of the solder layer (3). A sub-mount that has a high strength of bonding between the solder layer (3) and a semiconductor device is provided at a reduced cost.
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申请公布号 |
US2010263849(A1) |
申请公布日期 |
2010.10.21 |
申请号 |
US20060067355 |
申请日期 |
2006.09.19 |
申请人 |
NAKANO MASAYUKI;OSHIKA YOSHIKAZU |
发明人 |
NAKANO MASAYUKI;OSHIKA YOSHIKAZU |
分类号 |
F28F7/00;B23P15/26;C22C5/02 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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