发明名称 Producing method of wired circuit board
摘要 A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.
申请公布号 US2010263206(A1) 申请公布日期 2010.10.21
申请号 US20100662109 申请日期 2010.03.31
申请人 NITTO DENKO CORPORATION 发明人 TOYODA YOSHIHIRO;IHARA TERUKAZU
分类号 H05K3/00 主分类号 H05K3/00
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