发明名称 |
FLOATING METAL ELEMENTS IN A PACKAGE SUBSTRATE |
摘要 |
<p>A plurality of metal elements formed in an electronic package. The electronic package includes an electronic substrate and a plurality of metal elements disposed in a layer of the substrate. The plurality of metal elements do not serve an electrical function in the layer. Also, each of the plurality of metal elements is floating in the layer. In another embodiment, a method for optimizing the design of a package substrate is provided. The method includes identifying a space in a layer of the substrate that is free of metal and forming a plurality of metal elements in the identified space, where the plurality of metal elements do not serve an electrical function.</p> |
申请公布号 |
WO2010121167(A1) |
申请公布日期 |
2010.10.21 |
申请号 |
WO2010US31439 |
申请日期 |
2010.04.16 |
申请人 |
QUALCOMM INCORPORATED;YAO, JACK MONJAY;ZANG, RUEY KAE |
发明人 |
YAO, JACK MONJAY;ZANG, RUEY KAE |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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