| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attain thickness reduction of a BGA (Ball Grid Array) package. <P>SOLUTION: An electronic apparatus includes a housing 2, a circuit board 20, a BGA package substrate 18 having a first surface 18A with a solder ball 19 and a second surface 18B with an element containing hole 18h, a semiconductor element 14 which is at least partially contained in the element containing hole 18h in the BGA package substrate 18, electronic components 11a-11f packaged on the second surface 18B of the BGA package substrate 18, and a heat radiation plate 11 thermally connected with the semiconductor element 14 in opposition to the second surface 18B of the BGA package substrate 18 and has component containing holes 11a-11f for containing at least part of the electronic components 11a-11f. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
