| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC chip superior in physical strength even though it is thinned, and a highly reliable IC medium that has a strength enough to prevent breakage even if the IC chip is not sealed by resin or the like in mounting the IC chip is to an antenna sheet to form an inlet, and has excellent surface smoothness. <P>SOLUTION: A laminate body is formed by laminating a reinforcing plate 4 via an adhesive layer 3 on one surface of a silicon wafer 2 wherein an integrated circuit and a connection terminal are formed, and when it is diced and divided into IC chips, laser is used to dice at least the reinforcing plate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
