发明名称 APPARATUS AND METHOD FOR FORMING COATING FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus for forming a coating film in which the time for attaching/detaching a workpiece to/from a workpiece holding jig and time for surface treatment of the workpiece are shortened and formation of the coating film onto a surface of the workpiece is efficiently performed by continuously performing the surface treatment of the workpiece and the formation of the coating film onto the surface of the workpiece in one process with one device. <P>SOLUTION: In the apparatus for forming the coating film, the surface treatment is applied to the workpiece supported in a treatment chamber to impart compressive residual stress to the workpiece and the coating film is formed on the workpiece. The apparatus includes a surface treatment mechanism movable along the workpiece to spray electrolytic solution containing projection material to the surface of the workpiece with high pressure and impart the compressive residual stress, and a coating film forming mechanism movable along the workpiece to spray the electrolytic solution to the surface of the workpiece with low pressure and form the coating film. The workpiece is electrically connected to a power source in a positive electrode side, and an electrode of the coating film forming mechanism is electrically connected to the power source in a negative electrode side. Respective jet nozzles of the surface treatment mechanism and jet nozzles of the coating film forming mechanism are concentrically arranged. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010234499(A) 申请公布日期 2010.10.21
申请号 JP20090087122 申请日期 2009.03.31
申请人 DOWA THERMOTECH KK 发明人 SAKASHITA TAKEO
分类号 B24C1/10;C25D11/34 主分类号 B24C1/10
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