| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor device including a sensor element with suppressed characteristic deterioration due to the shrinkage during curing of a sealing resin and a method of producing the same. SOLUTION: The sensor device 10 includes a circuit board 12, sensor elements 14, 16, and 18 arranged on the upper surface of the circuit board 12, and a sealing resin 32 covering the sensor elements. The sensor element 14 and the sensor element 16 are provided with, on the upper surface of the board, a sensor part 26 and a sensor part 28, respectively. The sensor element 18 includes, on the side surface of the board, a sensor part 30. The sealing resin 32 is formed by injection molding, and the side surface in the longitudinal direction of the sensor element 18 is arranged in parallel to the injection direction of the sealing resin 32 upon injection molding. COPYRIGHT: (C)2011,JPO&INPIT |
