发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADDLE AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.
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申请公布号 |
US2010264529(A1) |
申请公布日期 |
2010.10.21 |
申请号 |
US20100823079 |
申请日期 |
2010.06.24 |
申请人 |
PUNZALAN JEFFREY D;BATHAN HENRY DESCALZO;CAMACHO ZIGMUND RAMIREZ;TRASPORTO ARNEL |
发明人 |
PUNZALAN JEFFREY D.;BATHAN HENRY DESCALZO;CAMACHO ZIGMUND RAMIREZ;TRASPORTO ARNEL |
分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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