发明名称 |
SOLID STATE IMAGING DEVICE AND IMAGING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To achieve both of actualization of a sufficient hole accumulation layer and reduction in dark current. <P>SOLUTION: A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: a plurality of pixel sections each having a light sensing section having a film formed on a light receiving surface of the light sensing section and lowering an interface state and a film formed on the film lowering the interface state and having negative electric charges, a hole accumulation layer being formed on the light receiving surface side of the light sensing section, and the light sensing section converting an incident light quantity into an electric signal; and a wiring layer provided on one surface side of a semiconductor substrate where the pixel sections are formed. The solid state imaging device may be applied as a back illuminated solid state imaging device having a configuration in which light incident from a side opposite a surface on which the wiring layer is formed is received in each of the light sensing sections. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010239154(A) |
申请公布日期 |
2010.10.21 |
申请号 |
JP20100146815 |
申请日期 |
2010.06.28 |
申请人 |
SONY CORP |
发明人 |
OSHIYAMA ITARU;ANDO TAKASHI;HIYAMA SUSUMU;YAMAGUCHI TETSUJI;OGISHI HIROKO;IKEDA HARUMI |
分类号 |
H01L27/14;H01L27/146;H01L27/148;H01L31/00;H01L31/10;H04N5/335;H04N5/361;H04N5/369 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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