| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module substrate which can easily and reliably join a semiconductor element to a circuit layer, a power module substrate having a heat sink, and a method of manufacturing a power muddle using the power module substrate. SOLUTION: In a power module substrate 10, a circuit layer 12 formed of aluminum or an aluminum alloy is provided on one surface of a ceramic substrate 11, and a semiconductor element is provided on the circuit layer 12 with a solder material disposed therebetween. A metallic film 32 formed of a metal having favorable junction performance to the solder material and a protective film 33 which covers and protects the metallic film 32 are formed at one surface side of the circuit layer 12. COPYRIGHT: (C)2011,JPO&INPIT |
