| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection, allowing formation of a cured product that can sufficiently reduce leakage of light in a substrate for mounting optical semiconductor elements, to provide a substrate for mounting the optical semiconductor elements and a method of producing the substrate using the composition, and to provide an optical semiconductor device. <P>SOLUTION: The thermosetting resin composition for light reflection comprises a thermosetting resin containing epoxy resin, and an inorganic oxide having a refractive index of 1.6 to 3.0, wherein the compounded amount of the inorganic oxide is from 70 to 400 pts.mass based on 100 pts.mass of the thermosetting resin. <P>COPYRIGHT: (C)2011,JPO&INPIT |
