POLYVALENT HYDROXY RESIN, EPOXY RESIN, METHODS FOR PRODUCING THEM, EPOXY RESIN COMPOSITION, AND CURED MATERIAL THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin which obtains a cured material excellent in flame retardancy, moisture resistance, low elasticity, or the like, is used for sealing an electronic components and is suitable for a circuit board material or the like, and to provide a polyvalent hydroxy resin and an epoxy resin composition. SOLUTION: The styrene-modified polyvalent hydroxy resin is obtained by reacting 1 mole polyvalent hydroxy compound such as a phenol novolac resin with 0.1-4.0 moles styrenes in the presence of an acid catalyst and has 250-400 g/eq. hydroxyl equivalent. The epoxy resin is obtained by reacting the polyvalent hydroxy compound with epichlorohydrin and has 310-500 g/eq. epoxy equivalent. The epoxy resin composition contains the polyvalent hydroxy resin or the epoxy resin as an essential component. COPYRIGHT: (C)2011,JPO&INPIT