| 摘要 |
An electrical module comprising a first electrically conductive substrate plate (101), a second electrically conductive substrate plate (102), and semiconductor components (103-110) between the first and second substrate plates is presented. The second substrate plate is shaped to have cuts (115, 116, 122, 123, 124) on its edge or apertures for providing access to control terminals of the semiconductor components in order to facilitate connection of wire bonds to the control terminals. Hence, the wire bonds to the control terminals can be made after the semiconductor components have been bonded to the first and second substrate plates. Furthermore, due to the appropriate shaping of the second substrate plate, the area of the second substrate plate does not need to be essentially smaller than that of the first substrate plate. Thus cooling via the second substrate plate is sufficiently balanced with cooling via the first substrate plate and, as a consequence, temperature stresses can be reduced. |
