SEMICONDUCTOR MODULE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method wherein a semiconductor module is miniaturized and the manufacturing process of the same is simplified.

SOLUTION: The method of manufacturing the semiconductor module includes a process wherein the laminated body 123 of an insulating resin film 122 and a conductive film 120 is arranged while a circuit element 142 is fixed to a substrate 140 to bury the circuit element 142 into the insulating resin film 122 and another process wherein the circuit element 142 is fixed to the insulating resin film 122 through pressing.

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