| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power control device that prevents the plastic deformation of a solder bump for connecting a semiconductor package to a printed board with small power consumption, an electronic circuit mounted device and a power control method. <P>SOLUTION: The power control device controls a heater for heating an electronic circuit having the semiconductor package and a printed board connected by the solder bump, and includes a first power control section 11 which controls power supply to the electronic circuit through a first power supply system, a second power control section 12 which controls power supply to the heater through a second power supply system, and a determination section 13 which determines whether the electric power is supplied to the electronic circuit by the first power control section and makes the second power control section supply power to the heater when it is determined that no power is supplied to the electronic circuit. <P>COPYRIGHT: (C)2011,JPO&INPIT |
