| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photocurable resin composition that is superior in dry-to-touch property, developability, and through-hole developability, and also achieves soldering heat resistance, electroless gold plating resistance, and electrical characteristicss equal to or higher than conventional those when being cured. <P>SOLUTION: An alkali-developable photocurable resin composition contains a hydroxy group-containing resin expressed by general formula (I), a carboxyl group-containing resin, and a photopolymerization initiator. In general formula (I): R<SP>1</SP>represents a hydronen atom or a 1-20C organic group; R<SP>2</SP>represents at least one functional group selected from a group consisting of a 1-10C alkyl group, a 1-10C alkylene group, and phenylene groups; R<SP>3</SP>represents a hydrogen atom or a 1-4C alkyl group; R<SP>4</SP>represents a hydrogen atom or a 1-4C alkyl group; p represents an integer of 1-5; q represents an integer of ≥2; m represents an integer of 1-4; and n represents an integer of 1-10. <P>COPYRIGHT: (C)2011,JPO&INPIT |
