| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC card having high resistance to impact stress. <P>SOLUTION: The IC card includes: a first substrate; an IC chip provided on the first substrate; and a reinforcing plate provided facing the IC chip. The reinforcing plate has a curved shape, and the recessed side of the curved shape of the reinforcing plate faces an IC chip side. The recessed-side surface of the reinforcing plate is formed of an insulator. The reinforcing plate is constituted by laminating a rigid plate and a plates made of the insulator, and the recessed surface side of the curved shape of the reinforcing plate is made of the insulator. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
