| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase a ratio of a mounting area while making a substrate compact. <P>SOLUTION: A semiconductor device includes: a substrate 10 having a through-hole 15; a line 14 formed from an upper surface to a lower surface of the substrate through the through-hole; a first semiconductor element 16, mounted on the substrate, of a rectangular shape having two adjacent sides different in length; electrodes 34 and 36 provided at ends of the first semiconductor element; a second semiconductor element 18, piled to cross on the first semiconductor element, of a rectangular shape having two adjacent sides different in length; bonding wires 39 for connecting the substrate line with the electrode of the first semiconductor element; and sealing resin 26 for covering the first and second semiconductor elements and the bonding wires. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
