发明名称 |
COPPER CLAD LAMINATE, AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper clad laminate sufficiently enhanced in the adhesive strength between a polyimide resin layer and surface treated copper foil and capable of sufficiently suppressing the lowering of the adhesive strength even in the case exposed to a high temperature atmosphere (e.g.; 150°C or above) for a long time (e.g.; 100 hr or longer). SOLUTION: The copper clad laminate is equipped with the polyimide resin layer and the surface treated copper foil laminated at least on one side of the polyimide resin layer. The surface treated copper foil is equipped with matrix copper foil, the rust proof treatment layer formed on the surface on the forming surface side of the polyimide resin layer in the matrix copper foil and the silane coupling agent treated layer formed on the surface of the rust proof treatment layer and the silane coupling agent treated layer is formed by adhering a silane coupling agent treatment solution containing a silane coupling agent in a concentration of 8-50 g/L on the surface of the rust proof treatment layer, followed by drying the silane coupling agent adhered rust proof treatment layer at 240-350°C. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2010234638(A) |
申请公布日期 |
2010.10.21 |
申请号 |
JP20090084799 |
申请日期 |
2009.03.31 |
申请人 |
NIPPON STEEL CHEM CO LTD |
发明人 |
FURUKAWA AKIKO;HATTORI KOICHI |
分类号 |
B32B15/08;C25D7/06;H05K1/09 |
主分类号 |
B32B15/08 |
代理机构 |
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主权项 |
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地址 |
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