METHOD FOR CONDUCTIVELY CONNECTING A COMPONENT ON A TRANSPARENT SUBSTRATE

摘要

The invention relates to a method for conductively connecting an electrical component having at least one conductive layer. The conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a lead material in the area where the component is to be connected to the conductive layer; the lead material is provided with energy supplied by an energy source such that the lead material melts, and a non-detachable, material-bonded, conductive connection between the electrical component and the conductive layer is formed.