| 摘要 |
There is provided an adhesive sheet for a semiconductor and a dicing tape integrated adhesive sheet for a semiconductor that are each good in cuttability when the sheets are each cut into individual pieces by expansion and are each good in embeddability into irregularities in a wiring board when the sheets are each molded thereto. An adhesive sheet for a semiconductor includes a resin composition containing a high-molecular-weight component and a filler, the breaking elongation of the adhesive sheet before curing is 40% or less at 0° C., and the elastic modulus of the adhesive sheet after curing is from 0.1 to 10 MPa at 175° C. |
