| 摘要 |
<P>PROBLEM TO BE SOLVED: To inexpensively manufacture a metal laminate for a flexible printed circuit board excellent in heat resistance, dimensional stability, adhesiveness, chemical resistance and alkali resistance and generating no curl by directly applying a heat-resistant resin solution to metal foil to dry coated foil. <P>SOLUTION: The metal laminate for the flexible printed circuit board is manufactured by applying a solution of a polyimide resin excellent in heat resistance, dimensional stability, adhesiveness, chemical resistance and alkali resistance to the single surface of the metal foil while leaving a constant amount or larger of a solvent and heat-treating the coated metal foil while removing the solvent and controlling the cross-linking reaction of the resin and alleviating the stress of the formed resin film layer in a roll form. <P>COPYRIGHT: (C)2011,JPO&INPIT |
