| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce material cost, by overcoming the problem that a gold wire is used as a metal thin wire in a conventional semiconductor device, which makes it difficult to reduce the material cost. <P>SOLUTION: In the semiconductor device, a semiconductor element 10 is secured onto an island 7, and a plurality of through-holes 8 are formed on the island 7 around the area to which the semiconductor element 10 is secured. Then, the electrode pads of the semiconductor element 10 and leads 4 are electrically connected by copper wires 11. In this structure, the material cost is reduced by using the copper wires 11 in comparison with gold wires. Also, by forming a gold ball 12 on the electrode pads, a short circuit between the electrode pads is prevented. <P>COPYRIGHT: (C)2011,JPO&INPIT |
