| 发明名称 |
HEAT SINK OF AT LEAST ONE ELECTRONIC COMPONENT |
| 摘要 |
The invention relates to a cooling body of at least one electrical component. According to the invention, a first cooling body section is designed as a spring and a contact surface is provided on the first cooling body section, between the cooling body and the at least one component.
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| 申请公布号 |
US2010265661(A1) |
申请公布日期 |
2010.10.21 |
| 申请号 |
US20080808061 |
申请日期 |
2008.11.11 |
| 申请人 |
WIRNITZER BERND;BREITENBACH JAN;KYNAST ANDREAS;SEIDEL THORSTEN |
发明人 |
WIRNITZER BERND;BREITENBACH JAN;KYNAST ANDREAS;SEIDEL THORSTEN |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
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