PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to easily design a circuit by previously forming a first circuit pattern on both sides of a base material. CONSTITUTION: A base material(50) includes a first insulation layer(40), a first circuit pattern(10) buried in both sides of the first insulation layer, and a penetration via(35). The penetration via connects the first circuit pattern on both sides of the first insulation layer. A pad(60) is formed on the base material. An electric device(70) is formed on the pad. An insulation layer(81) is formed to surround the top, bottom, and sides of the electric device on the base material. A third circuit pattern(101) is formed on the insulation layer.